thermal range

Thermal Dissipation (Thermal Management)

Thermal Pad / Gap Pad

MATERIALS

Silicone, Silicone-free, Plastic, Elastomer, Ceramic, Fiberglass, Graphite, Special particles…

MANUFACTURING PROCESS

Molding of material in the form of plates of variable dimensions

CONDUCTIVITY

From 1.2 to 50 W/mK

PROTOTYPING

Possible samples for full-size tests according to quantity

OPTIONS

As standard, 2 self-adhesive sides & without adhesion, or other possibility on request

PACKAGING

In sheets and/or in pieces cut by us

Full technical specifications:

Our thermal mattresses also called ‘Gap Pad or Gap Filler’ are thermally conductive materials based on silicone or not depending on the desired final application (industry or space). These thermal buffers solve the problems related to heat released by electrical or electronic components. They are almost all electrically insulating except those who have a very high conductivity generally. The “Type” example of use is as follows: connect your electronic component (or heating element) to your heatsink (radiator or chassis). Our mattresses improve the heat exchange between these 2 parts. The natural self-adhesion is appropriate for easy pre-assembly. You should know that air is a very bad thermal conductor. Our mattress fills these empty spaces. These spaces can be related to different factors. The latter are empty spaces caused by: component tolerances, different stack heights or different expansion coefficients. The mattress then manages the heat transfer flow in a + or – fast way according to the need. We can size them with you to optimize this dissipation. Non-elastic plastic mattresses allow for thermal contact on large surfaces with tolerances at near-zero pressure. In addition to their thermal quality, all our mattresses have very good anti-vibration damping characteristics. This allows you to compensate for your surface irregularities.

Ref.AB2E
téléchargeable
Thermal Conductivity W/mKHardness Shore 00Available Thickness (mm)Temperature in C° min/maxBreakdown Voltage kV/mmRth° *@30/35psi * Th=1mm * °C-inch²/WRth° *@30/35psi * Th=2mm * °C-inch²/WSizesSpecial properties
TGF_012_BXS1,2300,50 à 12-40/+1506,50,7501,20200*400Ultra soft
TGF_013_DXS1,3250,50 à 10-40/+1806,01,772,43200*400Ultra Soft/Fibre de verre
TGF_020_JUS2,0400,50 à 5-60/+18010,01,201,80480*460Extremely Soft
TGF_030_MUS3,0430,50 à 10-50/+170> 70,3700,590200*400Extraordinary Soft
TGF_030_AB4,5600,50 à 5-40/+18015,00,3200,550300*400Soft
TGF_055_WSS5,5550,50 à 2-60/+18010,00,3200,490460*100Very Soft
TGF_050_AB6,2500,50 à 11-50/+180≥ 10voir FT0,290310*310Ultra Soft
TGF_055_WSS9,0500,50 à 8-50/+180≥ 8voir FT0,250310*310Ultra Soft
TGF_062_AB12,5550,50 à 8-50/+180≥ 10voir FT0,194310*310Ultra Soft
TGF_066_AB14,5550,50 à 6-50/+180≥ 8voir FT0,150310*310Ultra Soft
TGF_090_AB16,6650,50 à 6-50/+180≥ 7voir FT0,112310*310Ultra Soft
TGF_125_AB17,8700,50 à 3-50/+180≥ 8voir FT0,089310*310Ultra Soft
TGF_145_AB2,1550,50 à 5-30/+125≥ 10,20,950voir FT310*310Silicone Free
TGF_166_AB3,0700,50 à 5-40/+1307,80,6401,12400*200Silicone Free
TGF_178_AB4,2500,50 à 5-30/+125≥ 10.20,650voir FT310*310Silicone Free
TGF_021_AB_NS6,0700,50 à 5-40/+1306,00,2800,550400*200Silicone Free
TGF_030_R_NS8,0700,50 à 5-40/+1207,80,1700,280400*200Silicone Free
TGF_042_AB_NS7,8810,50 à 5-25/+120voir FT0,2000,390230*230Silicone Free
TGF_060_W_NS10,0450,50 à 5-40/+125voir FT0,0700,060230*230Silicone Free
TGF_078_AB_NS15,0550,50 à 3-50/+180voir FT0,2800,500150*150Extremely Soft
TGF_080_Y_NS16,0400,50 à 3-50/+180voir FT0,124 (3,5psi)0,205 (3,5psi)130*130Extraordinery Softness
TGF_100_AB_NS20,0600,20 & 0,50-40/+150voir FT0,018 (ep.0.5mm)voir FT120*120Soft-Anisotropic LV
TEL_150_R50,0750,20 à 2-50/+180voir FT0,11voir FT140*140Softness

Similar products

Interface / Film Thermiques

Joint CEM en Mousse Tissu (FOF)

Mousse de Filtration ou Cellulaire non UL

Dissipateurs Thermique